Compression Mounting Compounds
Compression mounting compounds utilize heat and pressure to encapsulate a specimen. Buehler’s compression mounting media includes resins, phenolic powder, compression mounting powder and pre-molds that minimize shrinkage while protecting and preserving sample edges during the preparation process.
The choice of a compression mounting media compound depends on the goals of the lab and requirements of final analysis. Many different powders and pre-molds are available to meet the wide variety of needs including colored general purpose phenolic powder, hard mineral filled compounds, clear thermoplastic compounds and conductive compounds for SEM analysis.
Wide Portfolio for Every Application
- The choice of a mounting compound depends on the goals of the lab and requirements of final analysis. Many different compounds are available to meet the wide variety of needs including colored general purpose phenolic, hard mineral filled compounds, clear thermoplastic compounds and conductive compounds for SEM analysis.
Excellent Edge Retention for Optimal Preparation
- Excellent Edge Retention for Optimal Preparation.
Quick Cycle Set-Up with No Mess
- Eliminate measuring from the mounting process with PhenoCure Pre-Molds. Simply place a pre-measured puck of pressed phenolic powder into the mounting chamber and the cycle is ready to begin. Save time and maximize cleanliness by eliminating any measuring and pouring of powder.
|Compression Mounting Powder & Pre-Molds Specifications
|Hardness (Shore D)
|General purpose metallography
|General Purpose Metallography – Lower Hazard Level
|EpoMet™ F (Fine)
|Very hard materials with complex geometries
|When transparency of the mount is useful
|SEM analysis when carbon is not the object of analysis
|SEM analysis when copper is not the object of analysis
|Diallyl Phthalate – Mineral Filled
|Moderately hard material
|Diallyl Phthalate – Glass Filled
|Moderately hard material for etching
|EpoMet™ G (Granular)
|Very hard material